Smart Packaging Solutions announces the addition of STMicroelectronics
solution dual interface certified platform to its banking card offer. This way,
SPS customers benefit from the cost advantage of SPS EBooster technology
and are able to satisfy a wider scope of demand from financial institutions.
ROUSSET, FRANCE, April 22, 2013 - Smart Packaging Solutions is happy to
announce the addition of a new dual interface platform EMV certified solution to
its offer.
This dual interface EMV solution allows card manufacturers to propose dual
interface banking cards based on a JavaCard operating system, fully certified by
Visa, MasterCard and Interac. This platform is now qualified by SPS, and can be
delivered to card manufacturers, enabling them to benefit from the EBooster®
technology.
Olivier Brunet, Product and Marketing director at SPS, declares: “With the
addition of this platform based on STMicroelectronics solution, our customers are
given more options to ensure they satisfy the booming demand for dual interface
banking cards. This choice of platforms associated with the manufacturing cost
reduction brought by SPS EBooster® technology ensures card manufacturers are
in the best position to answer market demand”.
With this addition, thanks to SPS EBooster® technology and modular approach,
smart card manufacturers are given a full set of options: they can select between
major semi-conductor vendors, and choose native, JavaCard or Multos based
operating systems. This way, smart card manufacturers are able to adapt easily
to the complexity of market demand and ensure they are able to deliver banking
cards fitting all financial institutions requirements.
With this modular approach, SPS’s customers are ideally positioned to benefit
both from mature smart card based banking markets, for instance in Europe, Asia
or Latin America, and from upcoming developments such as the United States
and China.
SPS EBooster® technology allows smart card manufacturers of all sizes to deliver
reduced-cost high-performance dual technology cards to financial institutions
issuing banking cards. SPS platform consists in a micro-module with contacts for
EMV contact transactions integrating a small antenna, and an inlay with a full
card size antenna, coupled with the small antenna, allowing an efficient
communication in contactless mode between the card and the reader. This way,
and because there is no physical connection between both antennas, cards are
highly reliable, and even allow five lines of embossing in the ISO-defined area.
Thanks to the EBooster® technology, smart card vendors are able to deliver dual
technology contact & contactless cards without costly investments in their
production line. They can easily integrate a stable process that guarantees high
yield rates and reduced unit manufacturing costs for their dual interface card
embedding process.
About SPS
With more than 20 years of experience in the field of smart card technologies,
Smart Packaging Solutions is specialized in the design, manufacturing and sale of
contactless solutions dedicated to ID cards, e-passport and dual interface banking
cards. Headquartered in Rousset, France, SPS employs 100 people. The company
specializes in contactless and dual-interface products, with a recognized micro
packaging expertise. SPS has filed over 120 patents supporting its exclusive
technologies. More information at www.s-p-s.com
Contact
Olivier BRUNET, Product & Marketing director, SPS, contact@s-p-s.com,
tel: +33 4 42 53 84 44